Thermal-analysis software uses built-in intelligence

The 6SigmaET electronics-cooling software package is said to be the first major product for electronics thermal analysis developed in the last decade. The software helps build a model using objects with built-in intelligence to speed-up model creation, and also enables automatic gridding and simplifying post-processing. PCB-level designs can be done in the context of the data center as the final application, which enables development of rack-based systems and containerized or custom data centers.

The software streamlines model creation, gridding, solving, and post-processing. An automated process is used to convert incoming CAD data to intelligent objects such as the chips, capacitors, resistors, other components on a PCB, and heat sinks with complex shapes. For example, a heat sink can be snapped onto a chip and a chip can be snapped onto a board, eliminating the cumbersome positioning required with other electronics-cooling software. The intelligence enables automatic meshing, such as increasing the grid density in critical areas.

The software solves the conduction equations required to accurately simulate rotated or angled geometry such as angled DIMMs. It also provides a user interface that reduces learning time and the time required to perform basic modeling and reporting tasks. (From $25,000/year — available now.)